 Via holes that only connect one layer to another, without having soldering wires or pins into the hole, do not normally need thermal restriction.Wire-leaded components may require the thermal relief pattern to be customized or even omitted when carrying radio-frequency currents (where the additional inductance would be problematic), or where very high current densities are expected (where the spokes of the thermal relief may act as a fuse).In these cases the parts may require additional hand soldering during assembly.