CAF commonly occurs between adjacent vias (i.e. plated through holes) inside a PCB, as the copper migrates along the glass/resin interface from anode to cathode. CAF failures can manifest as current leakage, intermittent electrical shorts, and even dielectric breakdown between conductors in printed circuit boards. This often makes CAF very difficult to detect, especially when it occurs as an intermittent issue. There are a few things that can be done to isolate the fault location and confirm CAF as a root cause of a failure. If the issue is intermittent then putting the sample of interest under combined temperature-humidity-bias (THB) may help recreate the failure mode. In addition, techniques such as cross sectioning or superconducting quantum interference device (SQUID) can be used to identify the failure.