Aluminium and its alloys are difficult to solder due to the formation of the passivation layer of aluminium oxide. The flux has to be able to disrupt this layer and facilitate wetting by solder. Salts or organic complexes of some metals can be used; the salt has to be able to penetrate the cracks in the oxide layer. The metal ions, more noble than aluminium, then undergo a redox reaction, dissolve the surface layer of aluminium and form a deposit there. This intermediate layer of another metal then can be wetted with a solder.
One example of such flux is a composition of triethanolamine, fluoroboric acid, and cadmium fluoroborate. More than 1% magnesium in the alloy impairs the flux action, however, as the magnesium oxide layer is more refractory. Another possibility is an inorganic flux composed of zinc chloride or tin(II) chloride, ammonium chloride, and a fluoride (e.g. sodium fluoride). Presence of silicon in the alloy impairs the flux effectivity, as silicon does not undergo the exchange reaction aluminium does.