There are several design considerations and mitigation techniques that can be used to reduce the susceptibility to CAF. Certain material selection (i.e. laminate) and design rules (i.e. via spacing) can help reduce CAF risk. Poor adhesion between the resin and glass fibers in the PCB can create a path for CAF to occur. This may depend on parameters of the silane finish applied to the glass fibers, which is used to promote adhesion to the resin. There are also testing standards that can be performed to assess CAF risk. IPC TM-650 2.6.25 provides a test method to assess CAF susceptibility. Additionally, IPC TM-650 2.6.16 provides a pressure vessel test method to rapidly evaluate glass epoxy laminate integrity. This is helpful but it may often be better to use design rules and proper material selection to proactively mitigate the issue.