In high-temperature metal joining processes (welding, brazing and soldering), fluxes are nearly inert at room temperature, but become strongly reducing at elevated temperatures, preventing oxidation of the base and filler materials. The role of flux is typically dual: dissolving the oxides already present on the metal surface to facilitate wetting by molten metal, and acting as an oxygen barrier by coating the hot surface, preventing oxidation.
For example, tin-lead solder attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing the formation of metal oxides, flux enables the solder to adhere to the clean metal surface, rather than forming beads, as it would on an oxidized surface.