SU-8 2000 series resists use cyclopentanone for the primary solvent and can be used to create films between 0.5 and 100 µm in thickness.  This formulation may offer improved adhesion on some substrates versus the original formulation.
SU-8 3000 series resists also use cyclopentanone for the primary solvent and are designed to be spun into thicker films ranging from 2 to 75 µm in a single coat.
SU-8 GLM2060 series of low-stress photoresist consist of epoxy GBL and silica formulation CTE 14.
SU-8 GCM3060 Series of GERSTELTEC conductive SU8 with nanoparticles of silver.
SU-8 GMC10xx Series of GERSTELTEC colored SU8 Red, Bleau, Green, black and others.
SU-8 GMJB10XX Series of GERSTELTEC  low viscosities epoxy for inkjet applications.
SU8 GM10XX  Series of Classic GERSTELTEC epoxy.
Its polymerization process proceeds upon photoactivation of a photoacid generator (triarylsulfonium salts, for example) and subsequent post exposure baking. The polymerization process it a cationic chain growth, which takes place by ring opening polymerization of the epoxide groups.
SUEX is a Thick Dry Film Sheet (TDFS) which is a solventless formulation applied by lamination. As this formulation is a dry sheet, there is high uniformity, no edge-bead formation and very little waste. These sheets come in a range of thicknesses from 100 µm to over 1mm. DJMicrolaminates also sell a thinner range, ADEX TFDS, which are available in thicknesses from 5 µm through to 75 µm.