Organic fluxes typically consist of four major components:
* Activators – chemicals disrupting/dissolving the metal oxides. Their role is to expose unoxidized, easily wettable metal surface and aid soldering by other means, e.g. by exchange reactions with the base metals.
** Highly active fluxes contain chemicals that are corrosive at room temperature. The compounds used include metal halides (most often zinc chloride or ammonium chloride), hydrochloric acid, phosphoric acid, citric acid, and hydrobromic acid. Salts of mineral acids with amines are also used as aggressive activators. Aggressive fluxes typically facilitate corrosion, require careful removal, and are unsuitable for finer work. Activators for fluxes for soldering and brazing aluminium often contain fluorides.
** Milder activators begin to react with oxides only at elevated temperature. Typical compounds used are carboxylic acids (e.g. fatty acids (most often oleic acid and stearic acid), dicarboxylic acids) and sometimes amino acids. Some milder fluxes also contain halides or organohalides.
* Vehicles – high-temperature tolerant chemicals in the form of non-volatile liquids or solids with suitable melting point; they are generally liquid at soldering temperatures. Their role is to act as an oxygen barrier to protect the hot metal surface against oxidation, to dissolve the reaction products of activators and oxides and carry them away from the metal surface, and to facilitate heat transfer. Solid vehicles tend to be based on natural or modified rosin (mostly abietic acid, pimaric acid, and other resin acids) or natural or synthetic resins. Water-soluble organic fluxes tend to contain vehicles based on high-boiling polyols - glycols, diethylene glycol and higher polyglycols, polyglycol-based surfactants and glycerol.
* Solvents – added to facilitate processing and deposition to the joint. Solvents are typically dried out during preheating before the soldering operation; incomplete solvent removal may lead to boiling off and spattering of solder paste particles or molten solder.
* Additives – numerous other chemicals modifying the flux properties. Additives can be surfactants (especially nonionic), corrosion inhibitors, stabilizers and antioxidants, tackifiers, thickeners and other rheological modifiers (especially for solder pastes), plasticizers (especially for flux-cored solders), and dyes.