In the RHEED setup, only atoms at the sample surface contribute to the RHEED pattern. The glancing angle of incident electrons allows them to escape the bulk of the sample and to reach the detector. Atoms at the sample surface diffract (scatter) the incident electrons due to the wavelike properties of electrons.
The diffracted electrons interfere constructively at specific angles according to the crystal structure and spacing of the atoms at the sample surface and the wavelength of the incident electrons. Some of the electron waves created by constructive interference collide with the detector, creating specific diffraction patterns according to the surface features of the sample. Users characterize the crystallography of the sample surface through analysis of the diffraction patterns. Figure 2 shows a RHEED pattern. Video 1 depicts a metrology instrument recording the RHEED intensity oscillations and deposition rate for process control and analysis. 
Two types of diffraction contribute to RHEED patterns. Some incident electrons undergo a single, elastic scattering event at the crystal surface, a process termed kinematic scattering. Dynamic scattering occurs when electrons undergo multiple diffraction events in the crystal and lose some of their energy due to interactions with the sample. Users extract non-qualitative data from the kinematically diffracted electrons. These electrons account for the high intensity spots or rings common to RHEED patterns. RHEED users also analyze dynamically scattered electrons with complex techniques and models to gather quantitative information from RHEED patterns.