is used in the semiconductor industry in plasma etching of silicon oxide and silicon nitride. Known as R-23 or HFC-23, it was also a useful refrigerant, sometimes as a replacement for chlorotrifluoromethane (CFC-13) and is a byproduct of its manufacture.
When used as a fire suppressant, the fluoroform carries the DuPont trade name, FE-13.  is recommended for this application because of its low toxicity, its low reactivity, and its high density. HFC-23 has been used in the past as a replacement for Halon 1301(CFC-13B1) in fire suppression systems as a total flooding gaseous fire suppression agent.