# Magnetic materials e.g. alnico, sendust, Permendur, FeCo, Terfenol-D
# Superconductors e.g. A15 phases, niobium-tin
# Hydrogen storage e.g. AB compounds (nickel metal hydride batteries)
# Shape memory alloys e.g. Cu-Al-Ni (alloys of CuAl and nickel), Nitinol (NiTi)
# Coating materials e.g. NiAl
# High-temperature structural materials e.g. nickel aluminide, NiAl
# Dental amalgams, which are alloys of intermetallics AgSn and CuSn
# Gate contact/ barrier layer for microelectronics e.g. TiSi
# Laves phases (AB), e.g., MgCu, MgZn and MgNi.
The formation of intermetallics can cause problems. For example, intermetallics of gold and aluminium can be a significant cause of wire bond failures in  semiconductor devices and other microelectronics devices.  The management of intermetallics is a major issue in the reliability of solder joints between electronic components.