The process requirements for (Pb-free) SAC solders and Sn-Pb solders are different both materially and logistically for electronic assembly. In addition, the reliability of Sn-Pb solders is well established, while SAC solders are still undergoing study, (though much work has been done to justify the use of SAC solders, such as the iNEMI Lead Free Solder Project).
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220°C, or about 34°C higher than the melting point of the eutectic tin-lead (63/37) alloy. This requires peak temperatures in the range of 235–245°C to achieve wetting and wicking.
Some of the components susceptible to SAC assembly temperatures are electrolytic capacitors, connectors, opto-electronics, and older style plastic components. However, a number of companies have started offering 260 °C compatible components to meet the requirements of Pb-free solders. iNEMI has proposed that a good target for development purposes would be around 260°C.
Also, SAC solders are alloyed with a larger number of metals so there is the potential for a far wider variety of intermetallics to be present in a solder joint. These more complex compositions can result in solder joint microstructures that are not as thoroughly studied as current tin-lead solder microstructures. These concerns are magnified by the unintentional use of lead-free solders in either processes designed solely for tin-lead solders or environments where material interactions are poorly understood. For example, the reworking of a tin-lead solder joint with Pb-free solder. These mixed-finish possibilities could negatively impact the solder's reliability.